============================================================== Guild: wafer.space Community Channel: Information / general / Ideas for different size silicon area. After: 07/31/2025 23:59 Before: 09/01/2025 00:00 ============================================================== [08/21/2025 20:02] mithro_ [08/21/2025 20:02] mithro_ To be a little clearer; * (a) Eventually I hope that I can support any die size and use something like laser dicing. For now that is an added complexity / risk it doesn't make sense to take on (kinda like the gf180mcu process optimization idea that I abandoned). * (b) In the shorter term, given that you get back bare die by default, I believe there could be a few options for post processing to split them into even smaller units. [08/21/2025 20:04] mithro_ At the moment it is $7 USD per die -- so if we could divide the die into 8 parts, that would make it under $1 per die. [08/21/2025 20:05] mithro_ Given that 3 * BOM cost; * $7 USD per die really means a >$100 USD product. * $1 USD per die means that <$30 USD or even $10 USD type products become viable. [08/21/2025 20:05] 246tnt Ok, I wasn't really sure that dicing "a second time" was something doable at all at scale ... [08/21/2025 20:07] mithro_ @tnt - "scale" is a relative term, ~1,000 units it pretty small for PCBA and non-existant scale for semiconductor people. [08/21/2025 20:13] mithro_ Actually, if it's $7 USD per die and you want $1 USD per sub-die, then you can spend ~$1 USD per die to do the dicing. [08/21/2025 20:16] 246tnt By scale I meant, not 10 units done by hand. Because if you get the die in a gel pack like we dit from the skywater runs, I'm not sure how you put them in a laser dicing machine "in bulk" since the ones I've seen take full wafers ... [08/21/2025 20:18] 246tnt But it's not like I have tons of experience with dicing so it's very possible there is a way 🤷 ============================================================== Exported 9 message(s) ==============================================================